| 摘要 |
PURPOSE:To improve the adhesive strength of a film formed by plating to a molded article of polyamide resin by etching the article with an aqueous stannic chloride soln. and an aqueous acid soln. in two steps before plating to make the surface of the article uneven by partial dissolution. CONSTITUTION:A molded article of polyamide resin is primarily etched with an aqueous stannic chloride soln. before plating, and it is secondarily etched with an aqueous acid soln. By the two-step etching, the surface of the molded article is partially dissolved, so the surfcace is made finely uneven to produce an anchoring effect. The adhesive strength of a film formed by plating is improved by the anchoring effect.
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