| 摘要 |
<p>A semiconductor apparatus comprises a semiconductor pellet having upper and lower main surfaces, and upper and lower protector plates against thermal stress soldered to the upper and lower main surfaces, respectively, of the semiconductor pellet wherein the whole area of the lower protector plate is larger than the lower main surface but has an inner part smaller than the lower main surface and made thicker than an outer part by being bounded with a step, the inner portion being soldered to the pellet at the lower main surface region, whereby the surface of the outer portion is spaced from the lower main surface by a distance corresponding to the height of the step.</p> |
