| 摘要 |
<p>"Method of manufacturing an identification card and an identification manufactured, for example, by means of this method". An identification card with an integrated semiconductor circuit (13) which is mounted on a secondary carrier ( 11 ) and which is electrically connected to conductor patterns (3, 5) on both sides of the secondary carrier (11). The secondary carrier (11) is mounted in a primary carrier (29) together with the integrated semiconductor circuit (13). The secondary carrier (11) comprises a plated-through hole (7) which is partly removed in order to form a recess (15) in the secondary carrier (11) in which the semiconductor circuit (13) is accommodated. The semiconductor circuit (13) is electrically connected, by means of connection wires (23, 25), to a conductor pattern (3) on the secondary carrier (11) and,also using an electrically conductive glue (21) and the metal hole plating (18) of the remainder (17) of the plate-through hole (7), to the other conductor pattern (5) on the secondary carrier ( 11 ) . The identification card can be used whenever identification of persons or objects is required, for example, for payment or quality control of products during the manufacturing process.</p> |
