发明名称 Polypropylene resin for high-rigidity molded products
摘要 A polypropylene resin from which high-rigidity molded products can be produced even when no particular additive is added, is provided, which resin has a melt rate of 0.1 to 100, a density of 0.905 to 0.936, and a boiling n-heptane-insoluble part whose isotactic pentad ratio (Po) is 0.975 to 0.995, and whose pentad ratio (P2) having two different kinds of configurations of 0.002 to 0.000%, and preferably has a melting point of 165 DEG to 170 DEG C. as measured by differential scanning calorimetry.
申请公布号 US4522994(A) 申请公布日期 1985.06.11
申请号 US19820449857 申请日期 1982.12.15
申请人 CHISSO CORPORATION 发明人 CHIBA, HIROMASA;KUMAHARA, KATSUMI;HARADA, TAKAKIYO;OKA, TAKAHIRO;SATO, AKIHIRO
分类号 C08F4/00;C08F4/60;C08F4/658;C08F8/00;C08F10/00;C08F110/06;(IPC1-7):C08F10/06 主分类号 C08F4/00
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