MANUFACTURE OF SEMICONDUCTOR LASER DEVICE

摘要

PURPOSE:To attach a submount with precision and security to a stem by a method wherein a submount in contact with a heated stem is kept under pressure and allowed to cool down to temperatures lower than the melt point of solder. CONSTITUTION:A heater 1 with a small heat capacity is kept at 220 deg.C. An Au- plated stem 2 is fixed to the heater 1. Next, a coat of solder (Pb:40%-Sn:60%) is applied to a bonding section A. An Ag-plated Si submount 3 is placed on said solder for adhesion. The submount 3 is pressed down by a needle 4. The entirety is cooled down to 150 deg.C in a mixture of N2 and H2 supplied by a nozzle 5 for fixation of the stem 2 to the submount 3. The combination of the stem 2 and the submount 3 with the intermediary of a molten solder film is allowed to cool down under pressure and the submount 3 finds itself correctly positioned on the stem 2.