| 摘要 |
PURPOSE:To restrain the chip mounting cost from rising up by a method wherein either a metallic block protruding beyond a sealing resin surface directly below a mounting surface of a semiconductor chip or highly heat conductive material block is provided. CONSTITUTION:A metallic block adheres to the opposite side of the central part (die part) adhering to a semiconductor chip 3' of a lead frame 1'. In such a constitution, any heat generated by the semiconductor chip 3' may be conducted easily to the surface of the metallic block 7 through the intermediary of the central part of the lead frame 1' and the metallic block 7. |
