PARTS OF INTEGRATED CIRCUIT

摘要

PURPOSE:To make resin itself a radiating body by a method wherein a semiconductor chip is sealed with resin scatteringly-mixed with metallic powder provided with insulating film on the surface. CONSTITUTION:A semiconductor chip 2 connected to a metallic terminal with wires is sealed with a resin 8 scatteringly-mixed with metallic powder provided with an insulating film on the surface. Any metallic powder to be scatteringly- mixed with the resin 8 may be applicable if it may become an insulating body by means of forming an oxide film on the surface of powder of such a metal as aluminium, copper and iron etc. Besides, any minute particles other than the powder may also be applicable. The heat conductivity of the resin 8 may be improved by means of scatteringly mixing such a processed metallic powder with the resin 8 itself. When an integrated circuit part is resin-molded utilizing such a resin 8, the radiating effect of the resin 8 may be improved remarkably eliminating any conventional radiating plate.