发明名称 ROOM TEMPERATURE CURING ORGANOPOLYSILOXANE COMPOSITION
摘要 PURPOSE:A composition suitable as an electrical insulating material for the circumference of electronic contact member causing no contact difficulty, obtained by blending a specific organopolysiloxane with a specific alpha,beta- unsubstituted vinyloxysilane and a specified silane or siloxane. CONSTITUTION:(A) 100pts.wt. organopolysiloxane containing a molecular chain end hindered with a hydroxyl group, having >=0.01mmHg vapor pressure at 20 deg.C, and <=0.3wt% low-molecular siloxane is blended with (B) 1-25pts.wt. alpha,beta-substituted vinyloxysilane shown by the formula I (R<1> is monofunctional hydrocarbon; R<2> and R<3> are H, or monofunctional hydrocarbon; n is 3 or 4) having <=0.3mmHg vapor pressure at 20 deg.C or its partial hydrolyzate, and (C) 0.01-10pts.wt. silane or siloxane containing at least one monofunctional group shown by the formula II (R<4>, R<5>, R<6>, and R<7> are monofunctional hydrocarbon) in one molecule, having <=0.3mmHg vapor pressure at 20 deg.C.
申请公布号 JPS61209266(A) 申请公布日期 1986.09.17
申请号 JP19850049546 申请日期 1985.03.13
申请人 SHIN ETSU CHEM CO LTD 发明人 INOUE YOSHIO;ARAI MASATOSHI;SATO SHINICHI;YOKOO KOJI
分类号 C08L83/00;C08K5/5425;C08K5/5465;C08L83/04;C08L83/06;H01B3/46 主分类号 C08L83/00
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