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发明名称
DISPOSITIVO DI INCISIONE A PLASMA,PARTICOLARMENTE UTILE NELLA TECNOLOGIA DEI SEMICONDUTTORI
摘要
申请公布号
IT1089040(B)
申请公布日期
1985.06.10
申请号
IT19770029986
申请日期
1977.11.24
申请人
SIEMENS AG
发明人
分类号
C23F4/00;H01J37/34;H01L21/00;H01L21/302;H01L21/3065;(IPC1-7):H05K/
主分类号
C23F4/00
代理机构
代理人
主权项
地址
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