| 摘要 |
PURPOSE:To obtain an adhesive suitable for interim fixation of electronic parts, etc. concurrently servable as masking agent for soldering etc., by dissolving or dispersing in carbitol acetate solvent both styrene resin-dominant thermoplastic resin and silica filler. CONSTITUTION:The objective adhesive can be obtained by dissolving or dispersing in (A) a solvent consisting mainly of carbitol acetate (e.g. n-butylcarbitol acetate). both (B) a thermoplastic resin consisting mainly of styrene resin and (C) silica filler (e.g. fumed silica). Layers 4 and 5 comprising this adhesive applied, on insulation base 1, for the interim fixation of electronic parts 7 and for masking lead wire-connected point 2 are removed by e.g. trichloroethylene after soldering 8, then carrying out a second connection of e.g. the next lead wire 10. EFFECT:Causing no deformation in articles applied to, also capable of reducing operational steps involved.
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