| 摘要 |
PURPOSE:An epoxy resin composition excellent in moisture resistance, rust inhibition, adhesion, etc. and suitable as a sealing resin for semiconductor devices, obtained by mixing an epoxy resin with a curing agent, a metal dithiocarbamate, and a specified silicone compound. CONSTITUTION:The titled resin composition is prepared by mixing 100pts.wt. epoxy resin selected from among glycidyl ether epoxy resin, phenol novolak epoxy resin, etc., with a curing agent (e.g., phenol resin precondensate or m- phenylenediamine), 0.1-10pts.wt. metal dithiocarbamate (e.g., zinc dithiocarbamate), and 0.1-5pts.wt. alkylarylpolysilsesquioxane type silicone compound of the formula (wherein R1-R6 are each alkyl, aryl, alkenyl, or aralkyl), e.g., methylphenylpolysilsesquioxane.
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