| 摘要 |
A printed circuit board, and method for its fabrication, wherein a first side of the board includes a network of interconnection wires channeled generally in groups along pathways apart from the region for the installation of electrical components and the board apertures through which their associated leads pass. The network of wires is encapsulated below a plastic sheet adhered to the surface of the circuit board after wiring. The electrical components are subsequently installed from the same side as the network of wiring and are electrically connected into the wiring network by wave soldering applied to the opposite board surface. Such a printed circuit board permits the doubly efficient use of automated interconnect wiring in combination with component installation by wave soldering. The network of wiring is typically adhered to the surface by a layer of sheet adhesive applied under elevated temperature and pressure. The adhering of the interconnect network keeps individual wires from interfering with the installation of circuit components and makes possible the location of both components and interconnect wiring on the same circuit board side. This in turn frees the opposite side for mass installation techniques such as wave soldering. |
