发明名称 HEAT-RESISTANT RESIN COMPOSITION
摘要 PURPOSE:The titled composition excellent in workability and heat resistance, comprising a specified polyol-modified polyamide-imide resin powder, an epoxy resin, and a curing aid. CONSTITUTION:A polyol-modified polyamide-imide resin powder is obtained by reacting a polyol with a particulate polymer, reduced viscosity <=0.3 and average particle diameter of 0.05-2,000mum, obtained by reacting an aromatic polyisocyanate with a tricarboxylic acid anhydride at an equivalent ratio of 0.5- 1.0, and a temperature of 80-250 deg.C in the presence of (a) a first nonaqueous organic liquid which does not dissolve the particulate polymer formed (e.g., n-hexane) and (b) a second nonaqueous organic liquid which dissolves or swells a dispersion stabilizer soluble in component (a) and is immiscible with component (a) (e.g., N-methylpyrrolidone). 100pts.wt. epoxy resin is mixed with 50- 300pts.wt. above resin, 1-150pts.wt. epoxy resin curing agent and, optionally, 0.1-10wt% curing aid.
申请公布号 JPS60101110(A) 申请公布日期 1985.06.05
申请号 JP19830208837 申请日期 1983.11.07
申请人 HITACHI KASEI KOGYO KK 发明人 NISHIZAWA HIROSHI;KURIMOTO TOSHIYA;TASHIRO AKITSUGU;MUKOUYAMA YOSHIYUKI
分类号 C08G18/00;C08G18/34;C08G59/00;C08G59/40;C08G73/00;C08G73/10;C08L63/00 主分类号 C08G18/00
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