| 摘要 |
PURPOSE:To obtain the titled Al forming a fine ball which ensures improved bonding strength and a reduced cost by adding specified percentages of Si and Zr to Al. CONSTITUTION:An Al alloy consisting of 0.6-1.5wt% Si, 0.01-0.2wt% Zr and the balance essentially Al or further contg. <=0.3wt% in total of one or more among Ti, Cr, V, Cr and B is prepd. The Al has superior performance as the material of a bonding wire for electrically joining a tip electrode of a semiconductor element to an external lead frame. |
