| 摘要 |
PURPOSE:To improve the positioning accuracy of a photomask and the surface of electronic parts in the stage of forming a thin film on the surface of the electronic parts and forming a circuit by photoetching by providing a laser beam gun to a thin film forming device. CONSTITUTION:Plural pieces of samples 5 of electronic parts or the like are attached to a sample holder 6 and are disposed in a vacuum vessel 1. After the vessel 1 is evacuated to a vacuum in an evacuating part 2, gaseous Ar or the like is introduced under low pressure into the vessel and the holder 6 is rotated by a driving source 7 for rotation. A high voltage is impressed to a cathode 3 to form a thin film on the surface of the samples 5 by sputtering. A thin film 11 is formed over the entire surface of the photomask positioning mark 9 of the sample surfaces and a circuit 10 and thereafter the mark 9 of the samples 5 is irradiated by a laser beam gun 4 to remove the thin film 11 in said part. Since the mark 9 is exposed in the next exposing stage for photoresist, the positioning is made possible with high accuracy. |
