发明名称 |
Device for cooling a plurality of integrated modules combined on a rigid printed circuitboard to form logic cards |
摘要 |
Integrated modules are disposed on a rigid printed circuitboard with the entire rear surface of each module in contact with a common cooling plate. The individual contact pressure of the integrated modules against the cooling plate occurs by way of resilient elements respectively inserted between the printed circuitboard and the modules.
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申请公布号 |
US4521829(A) |
申请公布日期 |
1985.06.04 |
申请号 |
US19830526372 |
申请日期 |
1983.08.25 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
WESSELY, HERRMANN |
分类号 |
H01L23/32;H01L23/40;H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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