发明名称 FORMATION OF WIRING PATTERN BY MASKED VAPOR DEPOSITION
摘要 PURPOSE:To enable formation of a pattern having excellent accuracy in the stage of forming a wiring pattern on the surface of a substrate by masked vapor deposition by using a magnetic material to constitute either of a mesh for forming a metallic mask or a foil layer on which the wiring pattern is formed. CONSTITUTION:A metallic mask 1 consisting of a mesh 2 and a foil layer 3 formed of Ni or stainless steel on which a wiring pattern is formed is adhered to a substrate 4 for vapor deposition in a vacuum chamber 6 in the stage of forming the wiring pattern by masked vapor deposition on said substrate. At least one of the mesh 2 or the foil layer 3 is constituted of a magnetic material and is strongly attracted to the substrate 4 by a magnet 5. Since a material 8 to be deposited by evaporation is deposited in this state to the substrate, the material 8 is prevented from spreading to the spacing between the layer 3 and the material 4 and the pattern having high accuracy is formed.
申请公布号 JPS60100673(A) 申请公布日期 1985.06.04
申请号 JP19830206953 申请日期 1983.11.02
申请人 MITSUBISHI DENKI KK 发明人 KONDOU TAKASHI
分类号 B05C21/00;C23C14/04;C23C14/24;C23C16/04;H01L21/285;H05K3/14 主分类号 B05C21/00
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