| 摘要 |
PURPOSE:To enable to readily form ultrafine wirings having small electric resistance in a simple process by shaping a thin metal film accumulated on the surface of an insulating substrate, forming wirings of die bonding surface and a wire bonding wiring pad, and bonding external terminal pins vertically to the surface of the substrate to the end of the wirings. CONSTITUTION:A thin metal film having low electric resistance which mainly contains copper and aluminum is accumulated by depositing or sputtering on one surface of an insulating substrate 6, shaped by patterning by photoetching, thereby forming a die bonding surface 7 and wirings necessary to place a semiconductor chip such as wirings 8 extending from the wire bonding wiring pad. External terminal pins 9 are connected and bonded vertically to the surface of the substrate to the end of the wirings 8 and hence the end of externally producing without passing the substrate 6 by soldering. |
