| 摘要 |
PURPOSE:To enable optimum wire bonding even in the case of assemblying the same semiconductor chip to different packages, by a method wherein a plurality of bonding pads for the same signal are provided in the semiconductor chip. CONSTITUTION:Assume the signal pads 2 provided to the semiconductor chip 1 are bonding pads 2a-2d, the pads 2a and 2b are the same signal sections, and the pads 2c and 2d are the same signal sections, too. The semiconductor chip can be put in optimum wire bonding to different packages by providing a plurality of the bonding pads for the same signal according to the packages. |
