| 摘要 |
PURPOSE:To enable the leads of a lead frame to be held in common by a method wherein IC chips prepared by the use of an inversion mask resulting from the mirror inversion of the drawing data for the preparation mask of the IC chip arranged on the front of the lead frame is arranged on its back. CONSTITUTION:The front IC chip 3 and the back IC chip 4A are constructed by processing semiconductor wafers 1 with the preparation mask, which chips are arranged on the front and back surfaces of the lead frame, respectively; thus constructing an IC 5. For preparation of the chip 4A, the separate inversion mask 2A resulting from the inversion of the drawing data of the preparation mask 2 of the front chip 3 is used. This manner produces the equal relative relation of the chips 3 and 4A and the leads, enabling wire bonding to the same leads; accordingly, the working speed can be contrived to improve. |
