PRODUCTION OF LAMINATED PLATE FOR FORMING PHOTORESIST

摘要

PURPOSE:To improve adhesion by depositing a liquid photosensitive comps. contg. a halation preventive agent on a printed circuit board to the extent of not solidifying the compsn., laminating a photosensitive material layer having flexibility thereon and adhering said layer while pressurizing the layer at a specific temp. or below. CONSTITUTION:A liquid photosensitive compsn. added with a halation preventive agent is coated on both surfaces of a printed circuit board in the zone where light is shielded. The liquid photosensitive compsn. is then dried to the extent that the compsn. is not completely solidified. The drying is accomplished at 60- 80 deg.C until the solvent content decreases to 10-30wt%. The printed circuit board and the photosensitive material having flexibility are adhered while both materials are pressurized by a pressing roller at <=70 deg.C in the case of laminating said materials. The liquid photosenistive compsn. layer plays the role of the adhesive layer with the above-mentioned method by which the adhesion between the dry film and the printed circuit board is improved and the yield of the product is increased.