发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To cut down cost improving reliability by a method wherein tub-leads and leads are made of aluminium or aluminium alloy and the external leads excluding the sealing part is formed of metallic layer to make soldering process easier. CONSTITUTION:A lead frame 1, tub-leads 4, tub hanging leads 4a and leads 5 are formed of aluminium or aluminium alloy. The thermal expansion coefficient of them is made almost equivalent to that of resin forming the sealing part 10 to make adhesion of resin to the tub leads 4 and leads 5 excellent improving moisture proof. The surface of external lead 5a excluding the sealing part 10 is made of aluminium or aluminium alloy to be coated with metallic layer such as iron, copper, nickel base, lead, tin and the like.
申请公布号 JPS6097651(A) 申请公布日期 1985.05.31
申请号 JP19830204805 申请日期 1983.11.02
申请人 HITACHI SEISAKUSHO KK 发明人 TSUBOSAKI KUNIHIRO
分类号 H01L23/50;H01L23/495 主分类号 H01L23/50
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