| 摘要 |
PURPOSE:To improve the productivity of wafers by a method wherein a plurality of wafers housed in a housing device of two or more lots are placed in a buffer part, and they are transferred to a processing jig, thereby enabling to perform a batch processing on a large quantity of product group. CONSTITUTION:A wafer accommodating device 19 is delivered to an undulation case 3, wafers are positioned in horizontal state by moving them pivotally, and all wafers are pushed out simultaneously and transferred to a housing body 37. The housing body 37 is moved to position D by pivotally moving them 90 deg., and the OF of the wafers is horizontally made even using a position correcting mechanism 43. The housing body 37 is moved to position E, and the retained 25 sheets of wafers are dropped and inserted in a carrying-in buffer 11 simultaneously. The conveyance of wafers is repeated four times and 100 sheets of wafers are placed on the buffer 11, and the are moved to position F. A wafer 16 is moved to a heat treatment device 18 by raising the placing table 70 of a transfer 12, the heat treatment device 18 is transferred to a loader 15 using a transferring device 17, and it is carried to the prescribed position I in a process tube 4. |
