| 摘要 |
PURPOSE:To provide the titled target apparatus capable of attaching and detaching a packing plate by an one-touch system, constituted of such a mechanism that a high m.p. metal plate good in heat conductivity and having rigidity is adhered to the back surface of a sputtering target and held by the packing metal at the time of thermal expansion of the metal plate. CONSTITUTION:In the sputtering target apparatus 2 provided in a vacuum chamber 1, a metal plate 6 having good conductivity, rigidity and a relatively high m.p. is adhered to the back surface of the target 4 by high temp. soldering. When the metal plate 6 is thermally expanded by sputtering, the peripheral part thereof is held by the holding means 7 of a packing plate 3. Therefore, the target 4 can be attached to and detached from the plate 3 by an one-touch system without requiring special fixing work such as screw clamping work. Because the exchange workability of the target is enhanced and the means 7 holds the plate 6 but does not directly hold the target 4, the target itself does not receive the force from the means 7 in thermal expansion and the deformation thereof can be prevented. |
