发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent the lowering of dampproofness and the crack of a pellet by fitting a chip in a chip fitting region, in which there is no bed and there are only inner and outer leads, through a resin tape and sealing the chip with a resin. CONSTITUTION:A polyimide tape 8 with adhesives in predetermined size is thermocompression-bonded with a fitting region for a chip 5 in a frame having only inner and outer leads 2 and 3. The inner leads 2 are fixed by the tape 8. A chip 5 is fastened to a fitting section, wired 6 and sealed 7 with a resin. In the constitution, there is no Al corrosion and migration due to Ag because an organic mounting agent such as Ag paste is not used, and dampproofness is improved. The generation of cracks due to the difference of expansion coefficients among members can be inhibited, and product yield is improved.
申请公布号 JPS6095941(A) 申请公布日期 1985.05.29
申请号 JP19830204310 申请日期 1983.10.31
申请人 TOSHIBA KK 发明人 KUROMARU AKIRA
分类号 H01L23/28;H01L21/60;H01L23/495 主分类号 H01L23/28
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