| 摘要 |
PURPOSE:To obtain a plug-in package having high reliability by mounting a printed wiring circuit with through-holes to a substrate using an organic group resin and aligning and arranging pins for connection to the outside conducting to the circuit. CONSTITUTION:Holes are bored to a glass epoxy both-surface copper lined laminated board in approximately 0.54mm. thickness, the through-holes are plated with Cu12, and a circuit pattern is completed through a normal method. Copper foils and metallic plating films 13 are left selectively on the back at that time. Solder paste 14 is printed to lands in the peripheries of the through-holes of the surface. Solder is composed of 5% Sn and 95% Pb. Pins 4 with collars 16 made of FeNi alloy are inserted into the through-holes, the laminated board is pushed by a block heater 17 to melt solder, and the pins 4 are connected to the lands. A semiconductor element is fitted to a pad 15, a frame is bonded and a resin is injected, the resin is covered with a cover having the same quality of material as the substrate, and the resin is heated and cured. According to the constitution, a plug-in package, which is lightened and thinned and has excellent shock resistance, dampproofness and heat dissipation properties, is obtained. |
