发明名称 LASER CUTTING METHOD
摘要 PURPOSE:To prevent sticking of molten and scattered material by forming a protective layer to a material to be worked, irradiating a laser thereto to remove only the protective layer of the cutting part then irradiating the laser having strong energy to cut the work. CONSTITUTION:A protective layer is preliminarily formed by an org. paint over the entire surface of a coil body 26 which is a material to be worked. The 1st charging and discharging capacitor 13 is subjected to pulse charging when the 1st thyristor 10 is turned on. The charging charge of the capacitor 13 is discharged to an excitation lamp 3 and a weak laser pulse is generated when a trigger pulse is impressed from a pulse generator 20 to a condensing and reflection mirror 1. The laser pulse is irradiated to the cutting part of the coil body 26. Only the protective layer is removed by such irradiation to expose the surface of the coil body 26. The 1st, 2nd and 3rd capacitors are charged from a control part 19. When the lamp trigger pulse is impressed, large discharge current flows to an excitation lamp 3 and the laser pulse having the large peak output is generated and is directly condensed and irradiated to the surface of the body 26, by which the working by evaporation of the cutting part 28 is accomplished.
申请公布号 JPS6096383(A) 申请公布日期 1985.05.29
申请号 JP19830202558 申请日期 1983.10.31
申请人 TOSHIBA KK 发明人 ISHIKAWA KEN
分类号 B23K26/00;B23K26/36;B23K26/38 主分类号 B23K26/00
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