| 摘要 |
<p>PURPOSE:To enhance solid-state image pickup characteristics and to reduce the size of the device by forming a color filter on a base having an absorption coefft. dependent on wavelengths and joining it with the solid-state image pickup device into one body. CONSTITUTION:Plural photosensitive parts are formed in a matrix on the principal face of a semiconductor substrate 1, and color filters 3 prepared separately on an IR absorbing glass base 2' are joined into one body with said photosensitive parts to form a solid-state image pickup device. As adhesives, light-transmitting adhesives 4, 5 are used. Since the IR cut filters are joined with said device in one body, its characteristics are improved and it is made unnecessary to attach another IR cut filter. As a result, the characteristics are enhanced and the device is reduced in size.</p> |
