| 摘要 |
PURPOSE:To obtain a semiconductor device, a package thereof is miniaturized even when the number of external lead pins increases and the lead resistance of package itself thereof is also reduced, by fitting the external lead pins, such as signal pins, power supply pins, etc. to a cap section. CONSTITUTION:A lower bonding pad 2-2, an upper bonding pad 2-3 and external lead pins 2-4 are formed to a ceramic substrate 2-1. Internal wirings 2-6 for a cap are formed on the whole surface of the back of the cap, and external lead pins 2-5 for the cap are shaped. A conductive substance such as AuSn is held in the whole region of a connecting surface 2-7, and exposed to a N2 atmosphere at the melting point or higher of AuSn, etc., and the upper bonding pad 2-3 and the internal wirings 2-6 for the cap are connected while a semiconductor element 2-8 is protected from moisture in the outside air, contamination, etc. Accordingly, the external lead pins for the cap are all used as power supply pins, the internal wirings 2-6 for the cap can be formed on the whole surface of the cap, and the power supply pins having very small wiring resistance can be shaped. |
