| 摘要 |
PURPOSE:To execute wire bonding easily by various bonding systems even when length of inner leads is long by mutually connecting lead wires by an insulator in a section in the vicinity of bonding sections for leads. CONSTITUTION:Metallized layers 4 consisting of Mo-Mn, etc. are formed to the side surfaces of holes, through which lead wires 1 are penetrated, in an alumina ceramic insulator 2, each lead wire 1 is sealed to a metallic base body 6 as a base for a package by glass 7 for sealing a metal, and several lead wire 1 is brazed and connected to the insulator 2 in the upper sections of flange sections 1-2. A semiconductor element is loaded on the metallic base body 6 through a device such as a cooling device, and the length of inner lead sections 1-1 in each lead 1 is lengthened. Accordingly, aluminum wires 3 are ultrasonic-bonded to the top surfaces of the lead wires 1, the lead wires are brought to a rigid state structurally, and strong bonding adhesive strength can be obtained. |
