EXPLOSION-PROTECTED SEMICONDUCTOR COMPONENT ARRANGEMENT

摘要

1. Explosion-protected semiconductor component arrangement a) having at least one encapsulated, disc-shaped semiconductor component (1) which possesses a housing having a jacket section, in the shape of a cylinder of circular cross-section, made of an insulator and b) having an explosion-protective jacket (7) which surrounds a bursting space (13) around the said jacket section characterised in that c) the semiconductor component (1) is electrically and heat-conductively connected to at least one cooling element (4, 4'), d) the explosion-protective jacket (7) at least partially surrounds at least one cooling element (4) at the outer periphery of the said element and serves to centre the element, and e) the explosion-protective jacket possesses at least one centring segment (9) for centring the semiconductor component (1) within the explosion-protective jacket.