| 摘要 |
PURPOSE:To obtain secure and stable brazing without formation of an unstable layer having a low m.p. by adding a specific amt. of P or Sb to specifically composed Pd solder thereby suppressing the diffusion between the solder component and the base metal component. CONSTITUTION:P is added at 0.1-3wt% or Sb is added at 0.1-5wt% to Pd solder consisting of 52-70wt% Ag, 20-30wt% Cu, 5-26wt% Pd without changing the compsn ratio thereof. If a Cu alloy is brazed by using such Pd solder, the diffusion of the Pd in the solder component to the Cu alloy side and the diffusion of the Cu alloy component to the solder layer are prevented by the effect of P or Sb, by which the formation of the two layers; a Pd-Cu layer and an Ag- rich layer is prevented. |
