发明名称 LASER WORKING METHOD
摘要 PURPOSE:To improve working accuracy in fine cutting and grooving by disposing a dummy material having good absorbing efficiency of thermal energy to a substrate to be worked and irradiating laser light from the upper part of the dummy material. CONSTITUTION:A substrate 1 is subjected to surface grinding and the surface thereof is further subjected to specular finishing. A thin metallic layer 2 is provided on the surface of the substrate 1 to form a composite substrate 3 which is the substrate to be worked. A dummy plate 5 consisting of a metal or metallic oxide is laminated and adhered atop the substrate 3 so as to sandwich the layer 2. The substrate 3 laminated and adhered with the plate 5 is immersed into the water 7 in a water tank 6 and laser light 10 is irradiated to the prescribed position of the plate 5 from above. The part irradiated with the light 10 of the plate 5 is immediately melted. The melting spreads to the part where the plate 5 is removed, i.e., the layer 2 of the part irradiated with the light 10 as well as the substrate 1. Grooves 15, 15- are thus formed in the prescribed position of the substrate 3.
申请公布号 JPS6092093(A) 申请公布日期 1985.05.23
申请号 JP19830198234 申请日期 1983.10.25
申请人 SONY KK 发明人 KASHIWA KAZUO
分类号 B23K26/18 主分类号 B23K26/18
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