Improved method for depositing a metal on a surface.

摘要

An improved method for making conductive metal patterns is claimed involving the steps of treating a substrate with a solution comprising a reducible salt of a non-noble metal and a light radiation sensitive reducing compound, exposing said substrate to light radiant energy, fixing with a solution comprised of a complexing agent followed by electroless deposition, the improvement comprising extending the life span of the fixing solution by maintaining the concentration of the light sensitive reducing compound of the fixing solution so that it does not exceed 0,4 m moles/l<Sup>i</Sup>ter.