| 摘要 |
<p>A decoupling capacitor and method of manufacture thereof are presented wherein the decoupling capacitor is formed and consists of a molded housing (12, 14) with integrally molded recesses (17) for a capacitive ceramic chip (54). The housing also is formed with integrally molded recesses and stabilizing tabs (42, 44) for active pins (38, 40) and either molded recesses and stabilizing tabs for dummy pins, or molded lugs (60,62) in lieu of dummy pins. Both the active pins (38, 40) and either the dummy pins (42, 44) or molded lugs (60,62) are on the same height level to promote symmetry and ease of handling.</p> |
