发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 PURPOSE:To obtain a resin compsn. which can be thoroughly cured by short time of heating and is suitable for forming a permanent protective film by combining a polymer having an epoxy group and an amine imide. CONSTITUTION:A resin compsn. is formed of (a) an unstad. compd. which has substantially at least two ethylene groups at the terminal and is photopolymerizable, (b) a photopolymn. sensitizer, (c) a linear high polymer compd. having an epoxy group at the side chain and (d) the amine imide expressed by the formula I (R1, R4 in the formula are the aliphat. hydrocarbon having 0-6 carbon atoms that can contain oxygen atoms, R2, R3 are the aliphat. hydrocarbon having 0-6 carbon atoms). The resin is photopolymerized with the (a) and (b). The (c) functions as a high polymer for forming a film in the compsn. and acts further synergistically with the (d) to increase the mol.wt. of the resin and to crosslink the same in extremely short time at 150 deg.C thereby rendering mechanical strength and heat resistance to the resin.
申请公布号 JPS6091352(A) 申请公布日期 1985.05.22
申请号 JP19830201762 申请日期 1983.10.26
申请人 SEKISUI KAGAKU KOGYO KK 发明人 ARAKI YASUHIKO;YANAGISAWA KUNIO;SHIYOUHI HAJIME
分类号 G03F7/038;C08G59/00;C08G59/40;C08G59/50;C08G59/54;C08G59/62;C09D163/00;C09J4/00;G03C1/00;G03F7/027 主分类号 G03F7/038
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