发明名称 Superconductive large-scale integrated circuit chip
摘要 A superconductive large-scale integrated circuit chip comprises a plurality of pads, a superconductive line which short-circuits respectively adjacent pairs of the pads, and an input buffer circuit. The input buffer circuit includes a Josephson junction which is either in a superconducting state or a finite voltage state in response to a magnetic field established by current that is supplied to the superconductive line by flowing in from one of the two pads and flowing out from the other pad. The input buffer circuit wave-shapes the externally supplied signal into an amplitude-controlled signal, and the latter signal is led by a superconductive line to a circuit within the chip which requires the signal. Even when the external signal current has become abnormally great due to noise, etc., any circuit situated halfway within the chip can be prevented from malfunctioning from the magnetic flux generated by the large current.
申请公布号 US4518868(A) 申请公布日期 1985.05.21
申请号 US19810278730 申请日期 1981.06.29
申请人 HITACHI, LTD. 发明人 HARADA, YUTAKA;YAMASHITA, KUNIO;KOTERA, NOBUO;TANAKA, HIROTOSHI
分类号 H01L27/18;H01L39/02;H01L39/22;H03K17/92;(IPC1-7):H03K19/195 主分类号 H01L27/18
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