| 摘要 |
PURPOSE:To prevent flashes from occurring and to eliminate a deflashing process by lining synthetic resin of restoring properties and heat resistance at places in a mold where flashes may occur. CONSTITUTION:Part of the mold 11 is coated with silicone resin layers 12a, 12b. The part 20 where a semiconductor chip is mounted at the disk part of a lead frame is set in this mold 11. Then, the mold 11 is filled with molten resin from the runner 5. No resin flashes occur on the disk part, the lead, etc. and deflashing has become unnecessary in the following process. |
