| 摘要 |
A device for regulating the temperature of an electronic component, such as a surface acoustic wave (SAW) component in a hybrid package, without dissipating large amounts of power. The device includes a positive-temperature-coefficient thermistor positioned in contact with the component of which the temperature is to be controlled, and an insulating body with included air spaces, positioned between the thermistor and the package, to provide a high thermal resistance between the thermistor and the package. In one preferred form of the invention, the insulating body is a length of glass tubing that has been deformed to include two flat surfaces for contacting the thermistor and the package. Another disclosed embodiment includes a second thermistor and insulator combination, to further increase the thermal resistance between the component and the package.
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