| 发明名称 |
METHOD OF SETTING COPPER/ALUMINUM INTERFACIAL BREAK-AWAY STRENGTH PREVIOUSLY |
| 摘要 |
A low temperature (about 0 DEG C. to about 100 DEG C.) method is disclosed for forming an ultrathin film of copper on an aluminum carrier sheet. By this method, which employs matte finish aluminum foil, the peel strength for separating the aluminum carrier from the copper film can be preset at a desired value between 0.1 and 2 pounds per inch. |
| 申请公布号 |
JPS6089570(A) |
申请公布日期 |
1985.05.20 |
| 申请号 |
JP19840155631 |
申请日期 |
1984.07.27 |
| 申请人 |
GENERAL ELECTRIC CO |
发明人 |
DERUTON ANDORIYUUSU GUREI JIYUNIA;ROBAATO UIRIAMU GURIIN |
| 分类号 |
B21C37/00;C23C14/14;C23C14/16;H05K3/02;H05K3/20;H05K3/38 |
主分类号 |
B21C37/00 |
| 代理机构 |
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