| 摘要 |
PURPOSE:To easily form a bump which is suited to production in small lot of various kinds by forming a bump to be formed on the electrode pad of semiconductor pellet by the wire bonding method. CONSTITUTION:An Au or Al bump 4 is formed with Au or Al ball 3 by repeating two times the nail head bonding on the electrode pad 2 of a semiconductor pellet 1. A flip chip IC5 manufactured by this method is coupled on a circuit pattern formed with a thin film 6 by the ultrasonic wave bonding method. By forming a bump 4 of IC5 with such a method, the flip chip IC which is suited to production in small lot of various kinds can be manufactured easily at low cost. |
