| 摘要 |
PURPOSE:To obtain the titled carrier suitable for fine patterning, capable of easy manufacture, and excellent in mass productivity at a low cost by a method wherein a bump consisting of the first and second Au layers having specific purities is thermocompression-bonded to the tip of a lead of the film carrier. CONSTITUTION:The bump 8 provided at the tips of a plurality of leads 2 extending to the device hole of a flexible insulation film 1 has the second Au layer 8b having a purity of 50% or more which is smaller than that of the first Au layer 8a, formed on this layer 8a having a purity of 99.0% or more. Thereby, at the time of junction to a semiconductor element 4, because of the hardness of the Au layer 8b of a lower purity, the short-circuit of the bumps can be inhibited by keeping the spread of the bump due to collapse to an extremely small degree. Besides, the leads are blocked from sinking in the bumps, and thus the contact thereof with the element edge can be prevented. |
