| 摘要 |
PURPOSE:To unnecessitate caulking work and then shorten the working time by method wherein a metallic substrate constituting a package is bonded to a side frame by adhesion and at the same time by positioning with a resin body adhered by insertion to the recess of the side frame bottom through the through hole of the substrate. CONSTITUTION:The resin side frame 2 is bonded to the metallic substrate 1 by insert-adhesion of the resin body 9 to the hole 8 of the substrate and to the annular recess 10 of the side frame from below. The resin body is made of the same resin as that of the side frame, e.g., polybutylene terephthalate or epoxy. The projection 13 of the substrate interposes between the side surface at the tip of the resin body and the annular recess. The resin body, substrate, and recess are adhered with the same adhesive as that of the adhesive 6; therefore the firm bonding of the substrate and the side frame can be realized without caulking work. |
