| 摘要 |
PURPOSE:To obtain the titled device of light weight, low cost, and high quality by formation of a cooling fin by means of a light metal such as aluminum by a method wherein a groove is formed at the bottom of the embossed recess of the cooling fin which relaxes strain influence on the disk of a semiconductor rectifier. CONSTITUTION:The semiconductor rectifier 1 is connected to the recess-form copper disk 1D with solders 1S in the order of a semiconductor element 1P and a lead 1L and is hermetically sealed with an Si rubber 1R. The lead is connected to an AC input terminal, and the disk is fixed by junction with a solder 2 to a copper plate 4 integrally formed to the bottom of the embossed recess in solid-phase so as to cover part of the annular groove 3b formed at the bottom of the embossed section 3a of the cooling fin 3 made of a light metal such as aluminum serving as a DC electrode. Thereby, the influence of strain received by the disk from the fin becomes decreased because of no tensile force from the disk side surface, and then the device difficult to receive the influence of strain due to heat can be obtained. |
