| 摘要 |
PURPOSE:To enhance the cooling effect, to reduce the weight and the cost, and to enhance the quality of a rectifier by bonding fixedly a semiconductor rectifier to a metal plate unit integrated with embossed projection of a light metal cooling fin by soldering. CONSTITUTION:A semiconductor element 1P, leads 1L are connected fixedly in this sequence by soldering 1S to a recess copper disc 1D, hermetically sealed with silicone rubber 1R to construct a semiconductor rectifier 1. The input side is connected at the lead to an AC input terminal, and the output side is bonded fixedly by soldering 2 to a metal plate unit such as a copper plate 4 capable of being brazed to the outer periphery of the rectifier 1 so that the diameter of the plate is equal to the outer diameter of the rectifier 1 and integrated in solid phase state to the embossed projection 3a of the fin and the height of light metal cooling fan 3 of aluminum is approx. the thickness of the plate of the fin so that the disc 1D becomes a DC electrode. |
