| 摘要 |
PURPOSE:To connect semiconductor devices mutually and easily by disposing a pad, to which a terminal area for an external terminal or an internal connecting terminal is formed, onto an insulating plate, projecting one part of the pad from the external form of the insulating plate and using one part of the pad as the terminal. CONSTITUTION:Pads 22, 23 for wire bonding are formed along the sides of an insulating plate 33 on the insulating plate 33, and a pad 24 for mounting a semiconductor chip is shaped at the center of the insulating plate 33. External terminal connecting areas 4, 41, 42 are formed to the pads 22-24. L-shaped internal connecting terminals 4', 41' projecting from the edge section of the insulating plate 33 are formed to the noses of the pads 22, 23. A plurality of such insulating plates 33 are arranged and the areas 4', 41' projecting from the insulating plates 33 are connected mutually, and the projecting areas 4', 41' of one of these insulating plates are used as external connecting terminals. According to such constitution, the insulating plates are mutually connected easily, and the insulating plates can be miniaturized. |
