| 摘要 |
PURPOSE:To dispense with heating and pressurizing processes from the manufacturing process as well as to prevent the generation of uneven parts on the surface of the titled card by a method wherein the photosensitive resin, which will be hardened when a light is projected thereon, is used as the card-form resin of the IC card wherein an IC module is buried. CONSTITUTION:An electrode pattern 6 to be used for connection and a circuit pattern 7 are formed on the surface of a glass epoxy film 5. The patterns 6 and 7 are connected using a through hole 8. An IC chip 9 is placed on the pattern 7, and they are connected by a conductor 11. A frame 12 is provided on the film 5, and a chip 9 is molded by resin 13. This IC module 3 is provided in a mold, photosensitive resin 2 is filled in the mold, and when ultraviolet rays are made to irradiate thereon, the resin 2 is hardened and formed into a card shape. An over-sheet 18 is provided on the surface of the resin 2 for reinforcement, and visible information and a magnetic recording function are given. According to this constitution, heating and pressurizing processes can be abbreviated, and the breaking of wire and the deterioration of characteristics can be prevented, thereby enabling to improve the reliability of the titled IC card. |
