| 摘要 |
PURPOSE:To prevent the generation of cracks on sealed resin as well as to improve the damp-proof property of a semiconductor device by a method wherein the island part on which a semiconductor element will be mounted is provided in the center of the sealed resin, and a lead part is exposed on the bottom face of the sealed resin. CONSTITUTION:An external lead 3, having the same plane surface as the bottom face of sealed resin 5, is formed and exposed. An IC chip 1 and an island part 2 are provided at the positon which is located almost in the center of a sealed resin 5. According to this constitution, the generation of cracks on the sealed resin can be prevented, and the infiltration of moisture into the chip 1 can also be prevented, thereby enabling to improve the damp-proof property of the semiconductor device. |
