METHOD OF MARKING SEMICONDUCTOR CHIPS, AND MARKED SEMICONDUCTOR CHIP

摘要

1. A process for marking semiconductor chips (1) in respect of at least one specific characteristic, characterised in that in order to provide an electronically detectable marking, at least one conductor path (7) connecting two contact surfaces (2, 3) arranged on the chip surface and which have no connection to a semiconductor structure arranged on the semiconductor chip (1), is severed in dependence upon the characteristic which is to be marked.