| 摘要 |
PURPOSE:To reduce the resistance of cutting to prevent a workpiece from splitting and cracking, by forming a plurality of cutting edges in the grinding surface of a rotary grindstone so that the workpiece is cut in several steps. CONSTITUTION:Cutting edges 12, for example, three in number, are formed in the cutting surface of a cup-shape rotary grindstone 11. With the use of these cutting edges 12, a semiconductor substrate 13 as a workpiece is cut in three steps by a predetermined thickness. With this arrangement the resistance of cutting which is concentrated into the substrate 13 may be dispersed to reduce the cutting resistance exerted to the substrate 13 so that it is possible to prevent the substrate 13 from splitting and cracking. |
